The requirements for CPU thermal grease for the AMD official guidelines for SP3 and sp5 socket processors

The requirements for CPU thermal grease for the AMD official guidelines for SP3 and sp5 socket processors

For AMD EPYC processors using SP3 (EPYC 7001/7002/7003) and SP5 (EPYC 9004) sockets, the thermal interface material (TIM) requirements differ from standard consumer CPUs due to the massive surface area of the Integrated Heat Spreader (IHS) and the multi-chip let internal layout

For AMD EPYC processors using SP3 (EPYC 7001/7002/7003) and SP5 (EPYC 9004) sockets, the thermal interface material (TIM) requirements differ from standard consumer CPUs due to the massive surface area of the Integrated Heat Spreader (IHS) and the multi-chiplet internal layout.

The following information summarizes the official guidelines and industry-standard practices from AMD and its thermal partners.

Preparation and Installation Tips:

Clean the IHS and heatsink base with isopropyl alcohol (90%+ purity) and a lint-free cloth to remove old paste or residue.

Apply the paste directly to the CPU IHS, not the heatsink (unless pre-applied TIM is used).

Mount the heatsink evenly, following torque specifications (e.g., 1.0-1.58 Nm for SP3/SP5 heatsinks, per manufacturer guides) in a cross-pattern to avoid uneven pressure.

After installation, run stress tests (e.g., via Prime95 or AIDA64) to verify temperatures and reapply if hot spots occur.

 

Alternatives: Some OEM coolers for EPYC come with pre-applied TIM, which meets AMD's requirements out of the box. Thermal pads (e.g., graphite-based like Thermal Grizzly KryoSheet) can be used for easier application but may offer slightly lower performance than paste in high-TDP scenarios (e.g., 400W+ EPYC models).

 

These guidelines are derived from AMD's recommendations for comparable platforms and testing by reputable sources. For mission-critical setups, consult your server OEM (e.g., Dell, HPE, or Mitac/Supermicro) for socket-specific advice, as they often provide EPYC-compatible cooling kits with tailored instructions. If using custom cooling, ensure the solution supports the processor's TDP (up to 500W for some SP5 models).

1. Official AMD Stance: Pre-Applied is Preferred

For both SP3 and SP5 ecosystems, AMD's primary official guideline for system integrators is to use validated heatsinks with pre-applied TIM.

Reasoning: This ensures the correct thickness, volume, and spread pattern, which is critical for the large contact area (LGA 4094 for SP3, LGA 6096 for SP5).

Recommended OEM Materials: If you are looking for the specific industrial-grade grease used in these pre-applications, the industry standards cited in AMD thermal design guides and server cooler manuals (like Dynatron and Supermicro) are typically:

Shin-Etsu X-23-7762 (Most common)

Dow Corning TC-5026 (or TC-5600 series)

Honeywell PTM7950 (Phase-change material, increasingly common for high-heat density)

2. Manual Application Guidelines (Maintenance & Aftermarket)

If you are performing maintenance or installing a cooler without pre-applied paste, you cannot use a single "pea-sized" dot in the center. The IHS is too large, and a single dot will fail to cover the corner chiplets, leading to overheating.

 

Socket SP3 (EPYC 7000 Series / Thread ripper)

1. Socket SP3 (EPYC 7001–7003 & Thread ripper)

For the SP3 socket, the industry standard is often an "X" pattern or a multi-dot pattern to ensure the paste spreads to the corners where the CCDs (Core Complex Dies) are located.

How to Apply Thermal Paste to Your CPU
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Application Note: As shown in diagrams for this socket (often shared with Threadripper TR4), a common effective pattern is a large "X" across the IHS, often supplemented with 4 small dots in the open triangular spaces of the X.

 

Socket: LGA 4094

 

Official-Approved Pattern: Most validation guides (e.g., from Noctua or Supermicro) recommend a multi-dot pattern or an X-pattern.

 

The Recommended Pattern:

5-Dot Method: One large dot (approx. 4mm) in the center, and four smaller dots (approx. 3mm) near the corners.

X-Pattern: A large "X" across the entire IHS, often with 4 small dots in the open triangles of the X.

Why: This ensures paste reaches the dies located at the far edges of the substrate.

 

Socket SP5 (EPYC 9004 Series)

Socket: LGA 6096 (Significantly larger than SP3)

Official-Approved Pattern: Due to the immense size, the "Butterfly" or "X-pattern with perimeter dots" is required if manual application is necessary.

 

The Recommended Pattern:

 

Apply a full diagonal "X" from corner to corner.

 

Apply small dots in the center of the four open triangles created by the X.

Alternatively: Use a spatula to manually spread a thin, even layer across the entire surface (often recommended for server maintenance to guarantee 100% coverage).

 

Torque Spec: Critical for SP5. The heatsink must be torqued to 12.5–15.0 kgf-cm (approx. 10.8–13.0 lbf-in) using a T20 Torx driver to ensure the TIM spreads to the correct bond line thickness (BLT).

Type of Thermal Grease: Use a high-quality, non-electrically conductive thermal paste to prevent short circuits if any excess spreads to nearby components. AMD does not mandate a specific brand or thermal conductivity rating but pastes with at least 8-12 W/mK (e.g., those from Arctic, Noctua, or Thermal Grizzly) are commonly recommended for server-grade CPUs like EPYC. Avoid electrically conductive pastes (e.g., liquid metal) unless you're experienced, as they can damage the processor or socket.

Amount: Enough to achieve thin, even coverage across the entire IHS without excess spillover. Over-application can lead to mess or reduced performance; under-application can cause hotspots.

Application Method: Due to the large IHS and multi-chiplet layout in EPYC processors (e.g., up to 12 CCDs + I/O die in SP5 models), a single pea-sized dot (common for smaller Ryzen CPUs) may not suffice for full coverage. Instead, use a multi-dot pattern to promote even spreading under pressure from the heatsink.

Apply four 3-4mm dots in a rectangular pattern, positioned roughly halfway in from the four corners of the processor.

Then add nine smaller 2mm dots, interspersed evenly around and between the four larger dots (e.g., three 2mm dots along each shorter edge and three in a line across the center).